GENERAL APPLICATION GUIDELINES
MAIN POINTS TO SELECT SUITABLE
RELAY
A relay may meet with a variety of ambient conditions
during actual usage. In order to avoid unexpected failure
in result, testing over practical range under actual operating
condition is required. For proper use of relays, the characteristics
of the selected relay should be well known, and the conditions
of relay use has to be investigated to determine whether
they are matched to the environmental conditions, In addition,
the coil conditions, contact conditions, and the ambient
conditions for the relay that is actually used must be sufficiently
known in determining the relay specifications. The table
below shows a summary of points of consideration for relay
selection. It may be used as a reference for investigation
of items and points of caution.
Table 2. Main Ponts to Select Relays
Item |
Specification Points |
Consideration Points |
| Contact |
Contact arrangement |
Contact forms, number of poles, Contact sequence |
| Contact load |
Level of load, AC or DC, resistive or indicative or
capacitive, counter voltage of inductive load |
| Contact material |
Contact material should be matched to the level of
load |
| Life |
Number of operations, Frequency in switching |
| Coil |
Coll voltage |
Nominal voltage, power source ripple |
| Pick-up and Drop-out voltage |
Fluctuation in supply voltage, Rise in Pick-up and
Drop-out voltage due to the coil resistance rise |
| Coil resistance |
Power consumption of coil. Increase of resistance due
to the coil temperature rise |
| Temperature rise |
Ambient temperature and coil temperature rise according
to the applied voltage. |
| Insulation |
Dielectric strength
Surge withstand voltage
Insulation resistance |
Do specifications of the relays match that required
in the equipment? |
| Environment |
Ambient temperature and humidity |
Range of ambient temperature and humidity in the use
location. |
| Vibration and shock |
Level of vibration and shock in the use location. |
| Ambient atmosphere |
No presence of gas which may cause contact failure. |
| Others |
Mounting method |
The method of flux coating, soldering, washing and
mounting |
| Cover |
Material of cover (compatibility with washing solution) |
| Relay construction |
Sealed or non-sealed type relays |
| Special condition |
Are there any special conditions? |
CONTACT
(1) Contact load
The phenomena in the contacts of relays greatly vary depending
on contact load level such as kind of load and current level
as well as contact material and size, opening speed and contact
bounce.
-
Switching current
AC current is alternately reduced to zero but DC current
is not, so the arc discharge current at breaking of load
current is hard to be extinguished for DC current.
Therefore the duration of the arc discharge is longer in
DC circuit than AC circuit and the maximum DC switching
current is smaller than AC load.
- Resistive load
Resistive load is a standard load in life tests and the
contact ratings in catalogue are usually specified
with resistive
load.
In resistive load circuit, it is assumed that there
is no inrush or counter breaking current on switching
of loads.
- Inductive load
Inductive loads such as electromagnetic relay, solenoids
and motors easily generate a high counter voltage between
their coils and cause arc discharge across the relay
contacts.
Because the level of inductive load is affected by
the load current and the power factor (coso), the life
is decreased
when the power factor is lowered.
In circuit with load such as motor, solenoid, transformer
and others, an inrush current of several times larger
than the steady current is generated at the time of
connecting
the load.
It is necessary to select the contact that has a sufficient
capacity for the conditions.
- Capacitive load
In a capacitive load circuit, an inrush current of 20 to
40 times larger than the steady state current is produced.
A surge suppressor should be used to prevent contact
welding.
(2) Contact material
Relay contacts must be made from material that allows contact
resistance to be low and stable, that is not quickly
worn by the arc, and that has a high fusing point. At present
there is no material that meets these conditions, and
it
appears unlikely that one will be found in the near future.
Table 3. Typical Load and Inrush Current
Kind of Load |
Inrush current |
| Resistive load |
Steady state current |
| Solenoid load |
10 ~ 20 times of the steady state current |
| Motor load |
5 ~ 10 times of the steady state current |
| Incandescent lamp load |
10 ~ 15 times of the steady state current |
| Mercury lamp load |
Approx. 3 times of the steady state current |
| Condenser load |
20 ~ 40 times of the steady state current |
| Transformer load |
5 ~ 15 times of the steady state current |
| Contactor load |
3 ~ 10 times of the steady state current |
(3) Low level circuit
Circuits with several volts and several mA or less are
called low-level circuits. At low levels, silver contacts
form an
oxide or sulfide film on their surface under certain
condi
tions, which makes contact resistance unstable.
If the circuit impedance is high, although
the high contact resistance itself does not cause problems, the noise is easily produced.
To maintain stability of contact resistance in a
sulfurating atmosphere, contacts of gold overlayed
on silver-palladium
are effective.
COIL
(1) Coil voltage of DC relay
For the operation of DC relays, standards exist for power
source voltage, with DC voltage standards set at 5, 6, 9,
12, 24 and 48.
Because of the gradual increase or decrease of the current
impressed on the coil causing possible delay in movement
of the contacts, there is a possibility that the specified
contact capacity may not be satisfied.
So, consideration should be given to the method of applying
voltage on the coil.
(2) Power source fluctuation
As a power source for DC relays, a battery or either a half
or full wave rectifier circuit with smoothing capacitor is
used.
The characteristics with regard to the excitation voltage
of the relay will change depending on the type of power source,
and thus, in order to display stable characteristics, the
most desirable method is perfect DC.
In the case of ripple included in the DC power source, if
the smoothing capacitor is too small, humming develops and
unsatisfactory condition is produced, due to the influence
of the ripple.
This ripple is calculated using the formula described in
Fig. 4 and it is necessary to give consideration to use of
a power source with less than a 5% ripple.
(3) Coil resistance
The resistance of coil is specified according to the nominal
voltage of the relay. Generally, the nominal value of coil
resistance is that at 20°C (68°F) and the allowable
range is limited to within ±10%.
The resistance/temperature relationship for copper wire is
about 0.4% for 1°C, and with this ratio, the coil resistance
increases.
In order to operate the relay, the voltage necessary, becomes
higher than the specified voltage accompanying the rise
in the coil resistance.
Fig. 4. Ripple factor of rectifier circuit
| Ripple factor = |
E max. – E min. |
x 100 (%) |
 |
|
| |
E mean |
| |
E max. = Maximum value of ripple portion
E min. = Minimum value of ripple portion
E mean = Average value of ripple portion |
PERFORMANCE
(I) Contact resistance
(a) Contact wipe
The contact resistance of clean surface is extremely low,
such as several mOhms. In practice, some kind of film is
formed on to almost all of the contact surfaces and the contact
resistance varies depending on the properties of that film.
To clean such film and stabilize contact resistance, distance
of the contact wipe is increased.
When contacts open and close, the contacted surfaces slid
together, thus effecting a breakage of nonconductive film
formed on the contact surfaces.
(b) Contamination of contact surface
The possible causes of contamination that effects increases
in contact resistance are as follows.
- Adherence of fiber, scale and particles of plastic
mold, etc.
- Adherence of silicone oxides.
- Adherence and deposits of non-conducting material produced
through a chemical reaction with the gas absorbed onto
the contact face.
- Adherence and deposits of carbon powders produced at contact
surface.
- Oxidation and sulfuration of metallic powders on the contact
surface.
(c) A bifurcated contact is contaminated
The bifurcated spring is cut deeply enough and separated
so as to provide a good independence in a contact even
when some insulating particle is trapped between the contact
on
one side.
In this case, the contact of the other side can serve to
maintain a good contact, with the sufficient mechanical
independence be-tween the two members. So, the bifurcated
contacts have
successfully reduced contact failures.
(d) Sealed relay
Sealed relays are available. This feature excludes the
ingress of organic gases and dust in atmosphere and allows
immersion
cleaning.
When a sealed type relay switches the load in the presence
of organic gases inside relay, it produces carbon powders
on the contacts which create rise of contact resistance
and acceleration of contact consumption. In order to avoid
such
problems, the constituent components are annealed for physical
and chemical stability. This annealing process drives off
residual volatiles in the plastics, insuring a contaminant
free environment inside the sealed relay, resulting in
more stable contact resistance over life.
(2) Coil
- Nominal Coil Voltage (Rated Coil Voltage)
A single value voltage intended by design to be applied
to the coil or input.
- Pick-up Voltage (Pull-In Voltage or Must Operate Voltage)
When the voltage on an unoperated relay is increased, the
value at or below which all contacts must function
(transferred). The pick-up voltage is generally assigned to 70% of nominal
coil voltage so that the relay can function without
failure owing to fluctuation of voltage supplied, ambient temperature
raise and irregularity of coil resistance.
- Drop-out Voltage (Release or Must Release Voltage)
When the voltage on an operated relay is decreased, the
value at or above which all contacts must revert
to their unoperated
position. The drop-out voltage is generally assigned
to 10% of nominal coil voltage. Figure 5 shows the relationship
between Pick-up Voltage and Drop-Out Voltage.
Fig. 5. Relationship of Relay Performance

(3) Coil temperature rise
When voltage is applied to a coil, its temperature increases
due to juele heat. Coil temperature rise can be calculated
from the temperature coefficient of the copper wire by measuring
the coil resistance.
The coil temperature rise can be obtained by the next expression.
| T = T2 -Ta = |
R2 - RI |
(K +TI) + T1 -Ta |
 |
|
 |
| |
RI |
|
| where, |
T: Coil temperature rise (°C)
TI: Initial ambient temperature (°C)
T2: Coil temperature after the test (°C)
Ta: Ambient temperature after the test (°C)
Rl: Coil resistance at T1 °C (Ohms)
R2: Coil resistance at T2 °C (Ohms)
K: Constance (= 235 for copper wire) |
| however, |
I T1 - Ta 1 ‚ 5 (°C) |
(4) Hot coil and Cool coil
The coil temperature with no voltage applied on the coil is usually to be equal
to the ambient temperalure. When voltage is applied to the coil, the coil temperature
rises, increasing both coil resistance and pick-up voltage.
The coil with it’s temperature rise due to voltage impression is called
a Hot Coil. To the contrary, when no voltage is impressed on coil, the coil,
temperature of which is equal to ambient temperature, is called a Cool Coil.
In general, the values for characteristics such as pick-up
voltage, drop-out voltage and so on are measured at the
ambient temperature of 20°C 68°F,
Cool Coil conditions.
For the Hot Coil, because of it’s pick-up voltage rise, there is a possibility
that it may not operate under the same conditions as Cool Coil. Thus, care
is required.
(5) Operating range
(a) Maximum continuous voltage
The maximum voltage that can be applied continuously to
the coil without causing damage. When a voltage greater
than the maximum continuous voltage is applied
to the coil (layers may short) the coil may burn out, due to the temperature
rise. Do not exceed the usable operating range shown in the Fig. 7.
(b) Pick-up voltage
As the ambient temperature rises, the coil resistance increases,
pick-up voltage. Figure 7, line B refers to the relationship.
The upper portion of
line-B in
Fig. 7 shows the range of voltage which can be applied to the coil. Line-A
is maximum continuous voltage. Thus the relay operating range is the portion
surrounded by line A and B.
In order to have stable operation of relay, the app voltage
and the ambient temperature should be in the operating
range.
If the ambient temperature increases, pick-up voltages
rises, while maximum continuous voltage decrease. Care
is required.
(6) Operate time and Release time
There is variation in Operate time and Release Time depending
upon voltage/ power applied to coil.
Figure 8 shows an example of relationship between Operate
Time and Release Time. Figure 8 refers to the phenomenon
that according to the fluctuation of coil impressed voltage,
Operate Time greatly varies, while Release Time is small.
To the extent of large coil impressed voltage, the Operate
Time is rapid, but if it is too rapid, the make contact bounce
time may be extended.
(7) Safety standards
Laws and regulations demand securing the safety of users
from dangers such as electric shock and fire lying around
household appliances and other consumer electric equipment
or devices.
Major industrial countries across the world already have
their own safety standards such as those under control of ‘The
Electrical Appliance and Material Control Law’ in Japan,
UL in U.S. .A., CSA in Canada, VDE in Germany, SEMKO in North
Europe and BS in GB.
Coil temperature rise
| Fig. 7 Operating range |
Fig. 8 Operate and Release time |
 |
 |
MOUNTING OF RELAYS
(I) Mounting direction
Mounting direction is important for optimum relay characteristics.
(2) Shock and vibration resistance
It is ideal to mount the relay so that the movement of contacts
and armature is perpendicular to the direction of vibration
or shock, as shown in Fig. 10.
(3) Contact reliability
It is recommended to mount the relays so that the surfaces
of its contacts are vertical and in Lipper location of
relay inside. Such mounting methods prevent dirt and dust
as well
as scattered contact material (produced due to large loads
from which arcs are generated) and powdered metal from
adhering to them. Furthermore, it is not desirable to switch
both
a large load and a low level load with a single relay.
The scattered
contact material produced when switching large load adheres
to the contacts when switching the low level load and may
cause contact failure. Therefore, avoid mounting the relay
with its
low level load contacts located below the large load contacts.
(4) Adjacent mounting
When many relays are mounted close together, abnormally
high temperatures may result from the combined heat generated.
Mount relays with sufficient spacing between them to
prevent heat
buildup. This also applies when a large number of boards
mounted with relays are installed as in a card rack.
Be sure
the ambient
temperature of the relays does not exceed the value listed
in the catalog.
Fig 10. Direction of relays
| RELAY SOLDERING AND WASHING GUIDELINES |
Process |
Guidelines |
| 1. Mounting of relay |
|
|
- Avoid bending and terminals to make the relay
self-clinching.
Relay performance cannot be guaranteed if the terminals are bent.
|
| |
| 2. Flux coating |
|
|
- Adjust the position of the PC board so that
flux does not overflow onto the top of it.
- Use rosin-based flux, which is non-corrosive and requires
no washing.
- Do not use Automatic Flux Coating Method to dust-cover
type relays.
- Do not overflow onto the top of PC Board, in such a case,
the flux may even penetrate a flux-resistant type relay.
|
| |
| 3. Preheating |
|
|
- Be sure to preheat before soldering.
- Preheating acts to improve solderability.
- Preheat according to the following conditions.
| Temperature |
100°C 212°F or less |
| Time |
Within approx.1 minute |
- Note that long
exposure to high temperatures (e.g. due to a malfunctioning
unit) may affect relay characteristics.
|
| |
| 4. Soldering |
|
|
Automatic Soldering
- Flow solder is the optimum method for soldering.
- Adjust the level of solder so that It does not overflow
onto the top of the PC board.
- Unless otherwise specified, solder under the following
conditions depending on the type of relay.
| Solder Temperature |
Approx. 250°C 482°F |
| Soldering Time |
Within approx. 5 seconds |
| Solder Ratio |
Sn/Pb = 60/40 or 63/37 |
Hand Soldering
- Keep
the tip of the soldering iron clean.
| Solder Iron |
30W to 60W |
| Iron Tip Temperature |
Approx. 300°C 572°F |
| Solder Time |
Within approx. 3 seconds |
|
| |
| 5. Cooling |
|
|
- Immediate air cooling is recommended to prevent
deterioration of the relay and surrounding parts due
to soldering heat.
- Although the sealed type relay can be cleaned, avoid immersing
the relay into cold liquid (such as washing solvent)
immediately after soldering. Doing so may deteriorate the sealing performance.
|
| |
| 6. Washing |
|
|
- Do not wash flux-resistant type relays and
dust cover type relays by immersion.
- Careless washing may cause washing solvent to penetrate
the relay.
- Plastic sealed type relays can be washed by immersion.
Use washing solvents shown in Table 6.
- Use of other washing solvents may damage the relay case
and cover, and also cause washing solvent to penetrate
the relay.
- Avoid ultrasonic washing on relays. Use of ultrasonic cleaning
may cause breaks In the coil or slight sticking of
contacts due to the ultrasonic energy.
| Table 6. Washing solvent compatibility
chart for sealed relays |
Washing solvent |
| Chlorinated |
Chlorothene VG, N
Trichloroethylene
Perchloroethylene
Methylene chloride |
| Alcohol |
Ethanol
IPA |
| Aqueous |
Hollis 310
Indusco 624, 1000
Lonco Terg |
|
| |
| 7. Coating |
|
|
- If the PC board is to be coated to prevent
the insulation of the PC board from deteriorating due
to corrosive
gases and high temperature, note the following.
- Do not coat dust-cover type relays and flux-resistant
type relays.
- Depending on the type, some coating materials may have an adverse affect
on relays, select coating materials carefully.
|
RELAY TERMINOLOGY: PERFORMANCE
(1) Operate (Set) time
Time from initial energization to the first opening of closed
contact or first closing of open contact. This time does not
include any bounce time. In case of latching relays, this is
called “Set time”. (cf. Fig. 1.)
(2) Release (Reset) time
Time from initial de-energization of the relay coil to first
opening of closed contact or first closing of open contact.
This time does not include any bounce time.
In case of latching relays, this is called “Reset time”.
This means the time from initial reverse energization of
the coil to first opening of closed contact or first
closing of
open contact. (cf. Fig. 1.)
(3) Bounce time
Internally caused intermittent and undesired opening
of closed contact or closing of open contacts of a
relay. (cf. Fig.
1)
(4) Dielectric strength
The maximum. allowable AC (RMS) voltage (50/60 Hz)
which may be applied between two specified test points,
usually
for 1
minute in duration. In general, the maximum leak
current is I mA.
(5) Surge withstand voltage
The maximum allowable peak surge voltage which may
be applied between two specified test points.
Usually, wave form of this test is specified indicating
peak value, rise time and. fall time. (cf. Fig.
2.) In FCC Part
66, T1 = 10 µS, Vp 1500V are specified.
(6) Insulation resistance
The resistance between all mutually insulated
conducting sections of the relay. This value
changes depending
on the ambient temperature
and humidity.
Fig. 1 Typical time traces of relay

Fig. 1 Ware form of Surge test

(7) Capacitance
The electrostatic capacitance between mutually insulated conducting
sections of the relay. Usually this value is measured at
1 kHz.
(8) Life
- Mechanical life
The minimum number of operations which the relay can be operated
under nominal conditions with no load on the contacts.
- Electrical life
The minimum number of operations which the relay can be operated
under nominal conditions with specified load on the contacts.
(9) Vibration resistance
The resistance to the vibration applicable to the relay,
expressed as a displacement and frequency range.
- Functional
The vibration which can be applied to the relay during service
without causing the openings of the closed contacts
for more than the specified time.
- Destructive
The vibration which can be allowed by the relay during shipping,
installation, without damages and changes in
its operating characteristics.
(10) Shock resistance
The resistance to the shock applicable to the relay,
expressed as an acceleration in G.
- Functional
The shock can be applied to the relay during service without
causing the openings of the closed contacts for
more than the specified time.
- Destructive
The shock which can be allowed by the relay during shipping,
installation, without damage and changes
in its operating characteristics.
(11) Temperature range
The range of ambient temperature in which the relay
can be used without damages in its characteristics
or functions.
(12) Safely standard
Standard for the prevention of electric shock
hazards and fire accidents differs in content
from country
to country.
| |
UL (U.S.A.), |
VDE (Germany) |
| |
SEMKO (Sweden), |
CSA (Canada) |
| |
BS (G.B.) |
|
(13) Structure of relays
Relays are classified in 4 types as Fig. 3 by the structure
of terminals, cover and case, and mounting method of the
relay.
| Fig. 3. Structure of relays (Y: Yes N: No) |
(Y: Yes N: No) |
Item |
Dust cover Type |
Flux Free Type |
Sealed Type |
Surface Mount Type |
| Structure |
|
|
|
|
| Characteristics |
Most basic construction and there is gap between cover
and base, and between base and terminals. |
Terminals are sealed with base by sealant.
The joint level between cover and base is higher than the
PC board surface. |
All the gaps between case and base, base and terminals
are sealed by sealant. |
All the gaps between case and base, base and terminals
are sealed by sealant. Terminals are formed in “L” shape
intended to be soldered by reflow soldering. |
| Mounting Method |
Insertion mounting |
Insertion mounting |
Insertion mounting |
Surface mounting |
| Automatic Flux Coating |
N |
Y |
Y |
Y |
| Automatic Soldering |
N |
Y |
Y |
Y |
| Automatic Washing |
N |
N |
Y Note
1 |
Y Note
1 |
| Manual Soldering |
Y |
Y |
Y |
– |
| Environmental Gas Resistance |
N |
N |
Y Note
2 |
Y Note
2 |
Note
1. It is needed to select suitable washing solvent.
2. In explosive gas environment, use the metallic hermetic seal
types.
|