HAP02 Series

HAP02 Series

Features

  • 2 Form A and 2 Form C configurations
  • Low height, only 15.7mm
  • Creepage/clearance distance >10mm, Meets reinforce insulation
  • 5KVAC dielectric strength (between coil and contacts)
Recognized Component Mark

File No.:E75887

TÜV Product Certification

File No.:R 50461488

RoHS Compliant

Contact Ratings

Contact Arrangement2A, 2C
Contact Resistance≤100mΩ (1A 6VDC)
Contact MaterialAgSnO
Contact Rating16A/277VAC
Max. Switching Voltage277VAC
Max. Switching Current16A
Max. Switching Power4432VA
Mechanical Life5×106 operations
Electrical Life1×105 operations (2NO:16A/277VAC,
Resistive load 85°C, 1s on 9s off)

Characteristics

Insulation Resistance1000MΩ (at 500VDC)
Dielectric
Strength
Between coil & contacts5000VAC 1min
Between open contacts1000VAC 1min
Between contacts sets2500VAC 1min
Surge Voltage(Between coil & contacts)10kVAC(1.2/50μs)
Operate time (at nomi. volt.)≤10ms
Release time (at nomi. volt.)≤5ms
Humidity5% to 85% RH
Operation temperature-40°C~+105°C
Class FInsulation System Class F
Shock
Resistance
Functional98m/s2
Destructive980m/s2
Vibration resistance10Hz ~ 50Hz 1.0mm DA
Unit weightApprox. 16.5g
ConstructionSealed Type, Dust Cover Type,
Flux Tight Type

Notes: The data shown above are initial values.

Ordering Information

HAP02F2A16DC12 –E –XXXX
ModelF:Class F2A:2 Form A
2C:2 Form C
16:16ACoil VoltageC: Dust Cover Type S:Sealed Type E:Flux Tight TypeCustomer Code

Notes:
1. PC board assembled with dust cover type and flux tight type relays can not be washed and/or coated.
2. Dust cover type and flux tight type relays can not be used in the environment with dust, or H2S, SO2, NO2 or similar gaseous environment etc.

Coil Data at 25°C

Nominal
Voltage
VDC
Operate
Voltage
(Max.)
VDC
Release
Voltage
(Min.)
VDC
*Max.
Allowable
Voltage
VDC
Coil
Resistance
Ω±10%
53.50.507.531.3
64.20.609.045.0
96.30.9013.5101.3
128.41.2018.0180
2416.82.4036.0720
4833.64.8072.02880

Note:
“*Max Allowable Voltage”: The relay coil can endure max allowable voltage for a short period time only.

Coil

Coil PowerApprox. 800mW

Safety Approval Ratings

UL
&
CUL
&
CQC
N.O.:16A/277VAC, Resistive, 5×104 OPS, 85°C
N.O.:5A 120VAC, E. Ballast, 6×103 OPS, 40°C
N.O.:1HP 240VAC, Horse Power, 6×103 OPS, 40°C
N.O.:TV-8 120VAC, 2.5×104 OPS, 50°C
N.C.:16A/277VAC, Resistive, 2×104 OPS, 85°C
N.O./N.C.:16A/277VAC, Resistive, 6×103 OPS, 85°C
TüVN.O.:16A/277VAC, Resistive, 1×105 OPS, 85°C
N.O.:16A/277VAC, Resistive, 5×104 OPS, 105°C
N.C.:16A/277VAC, Resistive, 5×104 OPS, 85°C
N.O./N.C.:16A/277VAC, Resistive, 2×104 OPS,
85°C

NOTES:
1. All values without specified temperature are at 25°C.
2. The above lists the typical loads only. Other loads may be available upon request.

OUTLINE DIMENSIONS, WIRING DIAGRAM AND PC BOARD LAYOUT. Unit: inch(mm)

Outline Dimensions

Outline Dimensions Diagram

Wiring Diagram
(Bottom view)

Wiring Diagram

PCB Layout
(Bottom view)

PCB Layout

* The tolerance without indicating for PCB layout is always ±0.1mm.

Unless otherwise specified tolerances are:

≤1mm>1mm and ≤5mm>5mm
±0.2mm±0.3mm±0.4mm

PACKAGING SPECIFICATION

BLISTER BOXOUTER CARTONOUTER CARTONOUTER CARTON SIZE
25PCS650PCS1300PCSL580mm*W400mm*H175mm

APPLICATION GUIDELINES

Automatic Soldering
* Flow solder is the optimum method for soldering.
* Adjust the level of solder so that it does not overflow onto the top of the PC board.
* Unless otherwise specified, solder under the following conditions depending on the type of relay.

Preheat time
20°C-100°C
Rising slope
20°C-120°C
Decreasing slope
Peak-150°C
Welding temperature
255°C-265°C
90±5 seconds<3°C/s<4°C/s3~5s

Hand Soldering
* Keep the tip of the soldering iron clean.

Solder lron30W or 60W
lron Tip TemperatureApprox. 350°C 662°F
Solder TimeWithin approx. 3 seconds

* Immediate air cooling is recommended to prevent deterioration of the relay and surrounding parts due to soldering heat.
* Although the sealed type relay can be cleaned, avoid immersing the relay into cold liquid
(such as washing solvent) immediately after soldering. Doing so may deteriorate the sealing performance.

Discard the dropped product

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